Products
- FPC[10]
- Multilayer PCB[10]
- Other PCB & PCBA[10]
- Rigid PCB[10]
Contact Us
- Contact Person : Mr. Wu Daniel
- Company Name : Shenzhen Fulltronics Technology Co., Ltd.
- Tel : 86-755-83975258
- Fax : 0755-83246075
- Address : Guangdong,Shenzhen,31C,Block 2,DuShiYangGuang Building,No.6017,ShenNan Rd,Futian,Shenzhen,China
- Country/Region : China
Aluminium pcb board,MPCB,PCBA,HDI PCB Assembly
Product Detailed
Related Categories:Multilayer PCB
1.mpcb,aluminium pcb board,pcb assembly
2.2 layers
3.UL ,SGS ,ROHS,ISO
4.OEM & Design PCB
Fulltronic PCB Technical Capacity:
| PCB Production Capacity | |||||
| PCB Item | Manufacture Capacity | ||||
| Layer Counts | 1--20L | ||||
| Base Material: | FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) | ||||
| Material Thickness(mm) | 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 | ||||
| Max board size(mm) | 1200x400mm | ||||
| Board Outline Tolerance | ±0.15mm | ||||
| Board Thickness | 0.4mm--3.2mm | ||||
| Thickness Tolerance | ±8% | ||||
| Minimum line/space | 0.1mm | ||||
| Min Annular Ring | 0.1mm | ||||
| SMD Pitch | 0.3mm | ||||
| Holes | |||||
| Min Hole Size(mechanical) | 0.2mm | ||||
| Min Hole Size(laser hole) | 0.1mm | ||||
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | ||||
| Hole Position Tol | ±0.075mm | ||||
| Plating | |||||
| HASL/LF HAL | 2.5um | ||||
| Immersion Gold | Nickel 3-7um Au:1-5u'' | ||||
| Surface Finish | HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP | ||||
| Copper | |||||
| Copper Weight | 0.5--6oz | ||||
| Color | |||||
| Solder Mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue | ||||
| Silkscreen | White, Black, Blue,Yellow | ||||
| Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 | ||||
| Certificate | ROSH,ISO9001,UL | ||||
Fulltronics PCB Assembly Technical Capacity:
| PCB assembly Facility | |||||
| Equipment | Process | Brand | Model | Qty | Setup Time |
| High Speed SMT Machine | SMT | FUJI | CP6 | 1 | 2007 |
| FUJI | CP643 | 3 | 2008 | ||
| Multifunctional SMT Machine | SAMSUNG | 321 | 2 | 2009 | |
| SAMSUNG | 421 | 2 | 2009 | ||
| YAMAHA | YV100 | 2 | 2007 | ||
| Automatic Printing Machine | 6 | 2007 | |||
| Reflow Soldering(Leeded) | NOUSSTAR | 2 | 2007 | ||
| Reflow Soldering(Lead free) | 2 | 2007 | |||
| DIP line(Leeded) | DIP | 1 | 2007 | ||
| DIP line(Lead free) | 2 | 2008 | |||
| Wave Soldering(Leeded) | NITTO | 2 | 2007 | ||
| Wave Soldering(Leed free) | 2 | 2009 | |||
| Production assembly line | Assembly | 5 | 2007 | ||
| Functional Testing line | 2 | 2007 | |||
| PCBA repair line | 2 | 2007 | |||
| Automatic Optic Inspection | Test | ZHENGHUAXIN | VCTA-A410 | 2 | 2010 |
| Our PCBA Competence: | |||||
| ITEM | TECHNICAL PARAMETER | ||||
| Stencil size/range: | 736x736mm | ||||
| Minimum IC pitch: | 0.30mm | ||||
| Maximum PCB size: | 1200x 500mm | ||||
| Minimum PCB thickness: | 0.35mm | ||||
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) | ||||
| Maximum BGA size: | 74x74mm | ||||
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) | ||||
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) | ||||
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) | ||||
| Frequency of stencil cleaning: | 1 time/5 to 10 pieces | ||||
Aluminium PCB supply ability: 30000 Square Meter/Month
Certificate:ROSH,ISO9001,UL
Aluminium pcb board,MPCB,PCBA,HDI PCB Assembly
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